SMTA – Pin in Hole Intrusive Reflow Design & Assembly – 2021 Update

When:
June 14, 2021 @ 6:30 am – 8:00 am
2021-06-14T06:30:00-07:00
2021-06-14T08:00:00-07:00
Where:
webinar

https://smta.org/events/EventDetails.aspx?id=1518701&group=

By Bob Willis

$65 for members / $85 non-members

This webinar provides an update on the use of through hole reflow with high and low temperature solder paste plus experience gained on jetting paste and other processes trials conducted in the last few years.

Topics included in our webinar:

  • Overview of PIHIR design, assembly and inspection
  • Use of high & low temperature solder paste
  • Jetting paste as an alternative to stencil printing
  • Using solder preforms & solder bricks
  • Video reflow simulation
  • Solder joint reliability
  • Examples of common process defects and solutions
Comments are closed.

Powered by WordPress. Designed by WooThemes