Ray Prasad to Instruct “Four P’s of SMT” at Upper Midwest Chapter Tutorial Program
May 21, 2013 | Eden Prairie, MN
Learn how to resolve issues for an effective implementation of SMT in a lead free world at a lower cost and higher yield.
The objective of this course is to identify the technical issues in through hole, SMT, BGA, fine pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free. After very briefly providing an overview of SMT, the course provides details of all the SMT manufacturing processes including lead free soldering, Selective Soldering, and repair.