SMTA – Electro-Chemical Migration: ECM, CAF, SIR Testing, and Process Control

May 14, 2021 @ 8:30 am – 9:30 am

By Graham K Naisbitt

Electronic circuits have increased packaging density, reduced conductor spacing and more hostile operating environments that have led to an, ever increasing, susceptibility of electro-chemical failures. Trying to mitigate against this is not straightforward, as much because test methods to determine the likelihood of failure are, in themselves, often destructive. That is to say the tested product cannot be sent out to an end customer.  

With the broadening adoption of electronic systems into day-to-day products, many that are safety critical, and furthermore the operating requirements vary significantly, only serve to exacerbate the issue. Worryingly, too many manufacturers seem unaware of the failure mechanisms until it’s too late. It’s only when disaster strikes that the search begins to root out the culprit, and a first place to look are the prevailing standards.

This presentation explains the background for the latest developments, some of the issues that still require enhancement all of which is serving to bring awareness to the industry.

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