IEEE 16th Electronics Packaging Technology Conference (EPTC)

When:
December 3, 2014 – December 5, 2014 all-day
2014-12-03T00:00:00-08:00
2014-12-06T00:00:00-08:00
Where:
Marina Bay Sands 10 Bayfront Avenue Singapore

Advanced Packaging, TSV/Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials & Processes, Electrical Modeling & Simulations: Mechanical Modeling & Simulations: Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer/Package Testing & Characterization

AlfredYeo
Kallang Way 168
Singapore Singapore 349253
65 68400519
alfred.yeo@infineon.com

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