Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and the system level interconnection, (2) chemical, environmental and mechanical protection, (3) heat transfer, (4) power, ground and signal distribution between the die and system, (5) handling robustness, and (6) die identification among many others. Numerous critical technologies have been developed to serve these functions, technologies that continue to advance with each new requirement for cost reduction, space savings, higher speed electrical performance, finer pitch, die surface fragility, new reliability requirements, and new applications. Packaging engineers must fully understand these technologies to design and fabricate future high-performance packages with high yields at exceptional low-costs to give their company a critical competitive advantage.
This two-day class will detail the vital technologies required to construct IC packages in a reliable, cost effective, and quick time to market fashion. When completed, the participant will understand the wide array of technologies available, how technologies interact, what choices must be made for a high-performance product vs. a consumer device, and how such choices impact the manufacturability, functionality, and reliability of the finished product. An emphasis will be given to manufacturing, processes and materials selection tailoring and development. Each fundamental package family will be discussed, including flip chip area array technologies, Wafer Level Packaging (WLP), Fan-Out Wafer Level Packaging (FO-WLP), and the latest Through Silicon Via (TSV) developments. Additionally, future directions for each package technology will be highlighted, along with challenges that must be surmounted to succeed.