By Mike Konrad
So many assemblers are returning to cleaning to improve reliability. Many assemblers haven’t implemented post-reflow assembly cleaning in several years. So much has changed. Higher component densities, lower standoff heights, higher reflow temperatures, and a new cleanliness testing and process control standard from IPC are just some of the changes cleaning has seen over the past few years.
This webinar will compare and contrast past and modern cleaning challenges and review the new IPC cleanliness standards (IPC J-STD001H). The answer to how clean is clean enough has dramatically changed recently. We’ll review those changes and present methods to overcome modern cleaning challenges and ensure compliance with new IPC standards.