There are different techniques that can be used for solderability assessment; however, the wetting balance is the one scientific test which provides absolute results which can be compared with printed board assembly yields. Direct measurement of wetting is ideal for measuring changes in solderability on components and printed boards, but there are other ways you can use this technique to improve yields and reduce costs.
This webinar will cover:
Test methods and PCB/component requirements for testing
Typical test results and common failures found
Impact of ageing samples
Listing of NPL related reports
The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.