By Mike Konrad
Free for members / $25 non-members
While cleaning no-clean flux may seem redundant, there are many reasons so many assemblers are now cleaning no-clean. When no-clean flux was first introduced in the late 1980’s, so many things were different. The residue tolerance of circuit assemblies is substantially less today than it was when the concept of using a no-clean flux was first introduced.
This presentation will present the reasons assemblers are now cleaning their assemblies, especially those reflowed with no-clean flux. Contamination-related failure mechanisms will be reviewed and residue tolerance assessment considerations will be discussed.
Is residue removal right for your assemblies? Maybe, maybe not. Join us for an informative discussion on the subject of cleaning no-clean and determine if it is right for your assemblies.