SMTA WEbtorial PCB Surface Finishing Overview: Getting the Most Out of YOur Surface Finish

June 12, 2014 @ 8:00 am – 9:30 am

PCB Surface Finishing Overview: Getting the Most Out of Your Surface Finish
Register Now Two(2) Part 90 Minute Sessions
Thursday, June 12 & 19, 2014
11:00am to 12:30pm Eastern
Presented by: Lenora Toscano, MacDermid

The performance expectations of printed circuit board surface finishes are greater than just solderability preservation. Historically, final finishes were designed solely to protect copper from oxidation prior to the soldering of components. This included any storage and transportation from board manufacture to the assembly facility. Now the expectations are much greater; superior solderability, contact performance, wire bondability, corrosion resistance, extended end use life in aggressive environments and all this must be achieved at low cost. Designs have changed, lines and spaces are reduced, solder types and flux chemistries are different, there are a higher percentage of no clean assemblies, number of assembly cycles has increased, and many PCBs require multiple SMT steps and are followed by a selective or wave solder step. In addition to all these changes, there is a significant amount metal area left exposed in the end-use applications. This Webtorial will detail the process cycles, performance advantages and disadvantages of all surface finishes offered in the electronics market today. Sessions will be split by resultant solderjoint type; those that create Cu-Sn and those that create Ni-Sn solderjoints. A portion of the time will discuss areas of focus during fabrication to ensure the greatest performance from each individual finishes. This will not only benefit the line engineer but also supplier quality managers and the designers putting various finishes into their specifications.
1.Review of surface finish needs 2.Surface finishes available on the market 3.Process Cycles 4.Pros and Cons of each finish 5.Considerations for success with all surface finishes. 6.Part 1 will review nickel free surface finishes. Part 2 will focus on nickel containing finishes.

Who Should Attend:
Anyone who deals with surface finishes specifications and/or defect analysis. Those responsible for choosing the surface finish for end use products. Process engineers and supplier quality managers.

About The Instructor:
Lenora Toscano is the Director Final Finishes in the Electronics Division of MacDermid. Her responsibilities include innovation and marketing for all surface finishing specific to printed circuit boards. She also takes part in the development of new surface finishes outside of the conventional electronic markets. Her efforts have focused on developments that assess the compatibility between final finishes and different assembly and end-user applications. In addition, as the Director of OEM applications, Lenora works closely with fabricators, EMS and OEMs to understand customers’ needs for all MacDermid’s product lines. By narrowing the communication gaps within the electronic supply chain, Lenora is able to satisfy fabricators and OEM needs.

Lenora has been working for MacDermid for 15 years and has been published in numerous industry technical conferences. She holds four patents. She graduated from the University of Connecticut with a Bachelor’s Degree in Chemistry and received her Master’s Degree in Chemistry.

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