SMTA – The Effects of Surface Finish on Solder Paste Performance – The Sequel

November 5, 2020 @ 7:00 pm – 8:00 pm

By Tony Lentz

This is a second study on how solderable surface finish affects solder paste performance in the surface mount process (SMT). The first study was presented at SMTA International 2018 and included print, reflow and voiding data on 6 different surface finishes run with 4 different solder pastes. The performance of the surface finish – solder paste combinations were scored and ranked and recommendations given for optimal performance.

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