This brand new course begins with the basics of SMT solder paste stencil printing and ends with the latest research in stencil printing tools and technologies. The class starts with a quick description of printing fundamentals: solder paste characteristics and behaviors, the mechanics of the process and importance of a good setup, and the relationship between aperture sizes and paste deposit formations. It then progresses rapidly into troubleshooting techniques for both general and specific printing issues, and addresses problem prevention through proper stencil design and selection. Moving into advanced technology topics, the course reviews the last four years of independent research on stencil materials, manufacturing processes and nanocoatings, and closes with an update of automated Solder Paste Inspection (SPI) technologies, applications and special features. Attendees are encouraged to ask questions or bring specific problems to the class for suggestions and inputs.
Mechanics of the printing process
Troubleshooting process problems
Stencil materials and manufacturing processes
Automatic Solder Paste Inspection (SPI)
Review and Q&A