SMTA – Stencil Design for Solder Paste, In Process Inspection & Process Defects

When:
March 18, 2019 @ 6:30 am – 8:00 am
2019-03-18T06:30:00-07:00
2019-03-18T08:00:00-07:00
Where:
webinar

https://www.smta.org/webinars/#design

By Bob Willis

$25 for members / $95 non-members

The presentation provides a better understanding of solder paste selection and the use of stencil printing in modern fine pitch manufacture. Surface mount components are now at lead spacing of below 0.020″, only the correct selection of solder paste and specification of stencils can lead to effective printing. The session aims to provide a basic understanding of the design, production and quality control issues, both theoretical and practical issues of printing conventional surface mount and through hole for intrusive reflow.

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