By Fred Dimock
Free for members / $25 non-members
This webinar is based on the solder reflow fundamentals class and reflow section of the Jump Start Program that has been presented at SMTAI in Rosemont, IL. It is designed for the new SMT engineers/technicians or current engineers that want a better understanding of the reflow process. It discusses recipes vs. profiles, heat transfer in a reflow oven, oven control, why profiles are shaped the way they are, and how to obtain profiles. Additional topics of discussion include TC accuracy and mounting, profilers, test vehicles, and process windows.