Two (2) 90 minute Sessions
Nov 1 and 2, 2017
Presented by: Jennie S. Hwang, Ph.D.
$200 members / $275 non-members
With the goal to produce reliable products while achieving high yield production, this webtorial provides a holistic overview on solder joint voids. Four fronts in the industry have rekindled the interest and/or concerns about solder joint voids – the lead-free solder joints; the increased use of advanced packages (BTCs, PoPs); the ever-miniaturized electronics comprising “delicate” solder joints; and the increased demand in solder joint reliability for high performance and high reliability products. Different sources of solder joint voids, their respective causes and effects on the solder joint performance and reliability will be discussed. The practiced acceptance criteria of solder joint voids vs. real-world performance, and the steps to minimize solder joint voids of both the array solder ball solder joints (e.g., PoP, BGA, CSP) and lead-frame solder joints (e.g., QFP, BTC) will be outlined. The webtorial will conclude with the source of voids that is most critical to reliability, thus to avoid.
Driving Forces and potential effects
Likely impact on Reliability
Factors contributing to each of the sources
Role of solder alloy composition
BGA voiding – additional factors
BTC, PoP solder joint voids
Voids criteria vs. applications
Most critical source of voids to avoid
Summary & recommendations