SMTA – Risk Analysis in Electronic Assemblies

September 22, 2020 @ 6:30 am – 8:00 am

By Stefan Strixner

Free for members / $25 non-members

To avoid malfunctions of electrical assemblies in the field a proper risk assesment identifying potential failure sources in choosen manufacturing materials/processes & product design becomes more and more important. This presentation will give each delegate a brief overview on main risk sources and introduces meaningful examination methods for Validation vs. Process Monitoring. Practical applicability of the introduced topics will be demonstrated on a field case.

Topics included:

  • Differentiation of risk & failure analysis
  • Why becomes Risk analysis more and more important
  • Risk of hygroscopic/ionic substances & particle contamination
  • Analytic Methods for Risk assessment (focus on evaluation of Ionic Contamination and Technical Cleanliness)
  • Special risk on RF assemblies?
  • Case Study: Evaluation of Bondability on ENEPIG surfaces
  • Forecast and Perspectives
Comments are closed.

Powered by WordPress. Designed by WooThemes