By Mike Bixenman
This presentation is based on IPC J-STD-001H Cleanliness Guidelines that requires the manufacturer to qualify (N1D2D3) the soldering and/or the cleaning process that results in acceptable levels of flux and other residues. Objective evidence shall (N1D2D3) be available for review. The end product is a Qualified Manufacturing Process (QMP).
This presentation will present a process control plan based using temperature, humidity, and bias testing on site-specific components. The QMP is the result of the process that has been deemed acceptable by all parties that will be used as the baseline to compare future operations. Process control is concerned with process repeatability. The objective is to monitor variation outside the norm.