SMTA – Practical Failure Analysis Methods in Printed Board Assembly

When:
October 14, 2019 @ 6:30 am – 8:00 am
2019-10-14T06:30:00-07:00
2019-10-14T08:00:00-07:00
Where:
webinar

https://www.smta.org/webinars/#failure

By Bob Willis

$25 for members / $95 non-members

Different levels of failure analysis exist, from the very basic with virtually no equipment, to the use of a full failure analysis laboratory. Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools. When conducting any failure analysis, it is important the results prove the cause of the fault. The true reason for failure needs to be clear and proven with hard facts, not just opinions.

 Topics include:

  • Optical and X-ray inspection
  • Solder joint crack detection
  • Microsectioning
  • Component opening techniques
  • Surface analysis
  • Shear testing
  • Question and answer session
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