SMTA – Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

When:
April 6, 2021 @ 9:00 am – 10:00 am
2021-04-06T09:00:00-07:00
2021-04-06T10:00:00-07:00
Where:
webinar

https://smta.org/events/EventDetails.aspx?id=1498420&group=

By Nathan Blattau, PhD

$15 for non-members

The webinar will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.

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