By Kevin Byrd
Free for Everyone
As trends in consumer electronics continue to drive thinner and lighter designs, managing SMT yields and product reliability when using SAC reflow is increasingly challenging. Recent solder paste development activities have been targeted at addressing the historical reliability challenges of Tin-Bismuth based low temperature solder (LTS) materials. These updated materials are showing great promise in meeting product requirements while enabling significant reductions in reflow peak temperature. This topic will review the status of Sn-Bi solders, requirements for effective conversion from SAC to LTS, and suggest areas that would benefit from additional industry research efforts.