SMTA – Low Temperature Solder Benefits and Process Concerns

November 11, 2019 @ 6:30 am – 8:00 am

By Bob Willis

$25 for members / $95 non-members

The use of low temperature soldering is gaining interest in the industry to reduce cost, prevent component and PCB damage and improve reliability. It’s different but that does not mean it cannot be introduced into your process with existing process equipment. Generally speaking, solders used regally in assembly reflow at over 220°C, low temperature solders reflow at under 180°C. There are some organisations predicting a large growth in low temperature materials in the next two to three years for multistep soldering.

Many companies have been using tin/bismuth alloys for some years reducing cost on PCBs and energy. Other companies have been using tin/indium for rework of lead-free area array packages with success. There are savings to be made even if the cost of the solder alloy is much more expensive provided you consider the total cost of manufacture. We produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow, so we believe we are in a good position to help engineers achieve high yields with low temperature materials.

 Topics include:

  • Why use low temperature solder
  • Benefit over lead-free alloys
  • Materials available
  • Reflow soldering and rework results
  • Reliability with mixed alloys
  • Inspection results
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