$200 member / $300 non-member
Two (2) 90 minute Sessions
Tuesday, May 17 and Thursday, May 19, 2016
Presented by: Ning-Cheng Lee, Ph.D., Indium Corporation
Since the dawn of the electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperatures around 300C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200C. Low temperature solders with melting temperature < 180C are currently mainly used for niche applications. However, the iNEMI Roadmap predicts low temperature soldering to become one of the main stream processes by 2017. Low temperature soldering is greatly desired for a number of special applications, such as heat sensitive devices, systems with more hierarchic levels, parts with significant difference in coefficient of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.
Market Demand & Tentative Binary Alloys Options
BiSn + Ag
BiSn + Proprietary Dopants
BiSn + In, Ni
BiSn + Sb, Zn, Ag
SnInAg & Applications
What you will Learn
You will learn the benefits of low temperature soldering, and how this may broaden your options in product design, your soldering process, your choice of components and board materials, and hierarchic combinations. You will also know the variety of solder alloys, and the pro and cons of each of the alloys in terms of their properties and their performance at the applications.