SMTA Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies

October 16, 2014 @ 10:00 am – 11:30 am

Improving Mechanical, Electrical, and Thermal Reliability of Electronic Assemblies
Register Now Tim JensenTwo (2) 90 minute Sessions
Thursday, October 16 & 23, 2014
1:00pm to 2:30pm Eastern
Presented by: Tim Jensen, Indium Corporation

This webtorial is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of assemblies. It will not focus on mathematical modeling but rather provide data and tools that can be used by process engineers to make immediate impactful changes to the process.

This webtorial will be broken into three parts:
Course Outline:
1. Mechanical Reliability

Drop shock vs. thermal cycling vs. vibration
Alloys and element addition impact
Board and component finish impact
Component and board warpage
Increased solder volume

2. Electrical Reliability
Cleaned vs. No-Clean fluxes
SIR and Electromigration – Dendritic growth
Impact of low stand-off components (i.e. QFNs)
Creep corrosion
Conformal coating
Sn whiskering

3. Thermal Reliability
Types of thermal interface materials
Assessing thermal conductivity
Bond line thickness
Impact of pressure
Pump-out considerations
Solder joint thermal interfaces and voiding
Who should attend:
Process engineers, quality engineers, design engineers, and engineering management
Your Instructor:
Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials

Registrations are being taken through the SMTA Online Registration System.

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