By Rajan Ambat, Ph.D.
Free for members / $25 non-members
Electronic control units, power modules, and consumer electronics are used today worldwide under varying climatic conditions. The climatic conditions with different and varying humidity and temperature can result in transient high humidity and condensing conditions inside the device. Uncontrolled humidity interaction with electronics parts such as PCBA can introduce failures and functionality issues. The formation of water layer on the PCBA surface can be looked as the process of determining the risk of failure occurrence and the failure mode itself i.e. increase of leakage currents, electrochemical migration and corrosion.
The parameters such as solder mask, residues from PCBA assembly process, and PCBA layout and components have an influence on the water layer formation on PCBA surface and failures. Therefore it is fundamentally important to understand the influence of these factors and their relation to the sequential failure development under humid conditions and how to avoid them. This webinar will focus on the factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other hand can be used as a means to minimize humidity interaction with PCBA. Aim is to show the possibility of enhancing intrinsic humidity robustness of PCBA by incremental improvements by controlling the influencing factors.