DfM: Challenges & Opportunities
Two (2) 90 minute Sessions
Thursday, March 14 and 21, 2013
1:00pm to 2:30pm Eastern
Presented by: Cheryl Tulkoff, DfR Solutions
What You Will Learn:
In the electronics industry. the quality and reliability of any product is highly dependent upon the capability of the manufacturing supplier, regardless of whether it is a contractor or a captured shop. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations, which can result in severe financial pain and eventual loss of market share. What a surprising number of engineers and managers fail to realize is that focusing on processes addresses only part of the issue. Design plays a critical role in the success or failure of manufacturing and assembly.
Designing printed boards today is more difficult than ever before because of the increased lead free process temperature requirements and associated changes required in manufacturing. Not only has the density of the electronic assembly increased, but many changes are taking place throughout the entire supply chain regarding the use of hazardous materials and the requirements for recycling. Much of the change is due to the European Union (EU) Directives regarding these issues. The RoHS and REACH directives have caused many suppliers to the industry to rethink their materials and processes. Thus, everyone designing or producing electronics has been or will be affected.
This workshop provides a comprehensive insight into the areas where design plays an important role in the manufacturing process and also addresses the increasingly sophisticated PCB fabrication technologies and processes.
MODULE 1: INTRODUCTIONS
Intro to Design for Manufacturing
Key Global DfM Guidelines
MODULE 2: INDUSTRY STANDARD DESIGN RULES (Reference)
Overview of Industry Standard Organizations
MODULE 3: OVERVIEW OF DFM TASKS
Types of Review Processes
Root Cause Problem Solving
Failure Analysis (Reference)
MODULE 4: DfM – COMPONENT
Temperature Sensitivity Level
Moisture Sensitivity Level
MODULE 5: DfM – PRINTED CIRCUIT BOARD
Strain/Flexure Issues & Pad Cratering
MODULE 6: DfM – SOLDER
Lead Free Solder Alloy Update
Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.
Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She had held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer.
Registrations are being taken through the SMTA Online Registration System.