SMTA – Ball Grid Array Rework – How to Do It Successfully

May 4, 2020 @ 6:30 am – 8:00 am

By Bob Willis

$60 for members / $85 non-members

Surface mount and BGA rework and repair can be straight forward if simple rules are followed. This presentation will give each delegate a step by step blueprint to introduce rework successfully into manufacture. Guidelines will be given on selecting rework equipment, materials and training procedures for defect free soldering. Bob Willis was the creator of the world’s first video tapes and interactive CD-ROM on BGA Technology, X-Ray Inspection and BGA Rework which are sold worldwide by IPC and SMTA  

Topics included:

  • Introduction to rework, where and why rework
  • Soldering standards & defects, IEC, IPC, BT standards
  • Temperature profiling rework sites
  • Rework methods for:
  • BGA, CSP and other area array package
  • Hot gas/IR systems
  • Rework of single/double sided boards
  • Reballing BGA
  • Rework related defects
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