NPL Solderless Interconnect for Future Electronics Assembly

November 19, 2014 @ 6:30 am – 8:00 am

Solderless Interconnect for Future Electronics Assembly
Presented by Martin Wickham, NPL

Wednesday 19 November 2014 (14:30 hrs UK time)

Book your place here

This webinar will summarise the work being undertake at the UK’s National Physical Laboratory to better understand electrical interconnection materials which can offer an alternative to Sn-based solders. The projects discussed will include those involving both low temperature and harsh environment applications. Subject areas covered will include use of sintered silvers and high temperature conductive adhesives for operation above 200 ºC for such applications as aerospace, oil and gas, and automotive. Low temperature interconnection for assembly at temperatures below 150 ºoC for large area printed electronics, low cost printed sensors, smart packaging, wearable electronics and recyclable printed circuit assemblies will also be discussed.

This webinar will cover:

Solderless interconnections
Sintered solders
High and low temperature materials
Wearable electronics
Printed electronics
Smart packaging
The webinar will run for between 45-60 minutes, with a Q&A session. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

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