Achieving high reliability in service is the key issue in today’s high-density electronics assemblies. Electrochemical reliability becomes more critical, as electronic circuits move to increased packaging densities, and are operated in harsher environments (hotter/damper/condensing). Contaminants and bias with moisture facilitate electrochemical corrosion processes that result in a loss of continuity or short circuit (failures) on electronic assemblies. Moisture plays an important role for circuit failure, and condensation will accelerate the failures.
March 17, 2020 @ 7:30 am – 9:00 am