NPL Increasing the Performance of Organic PCBs at Higher Temperatures

January 17, 2019 @ 6:30 am – 8:00 am

There has been an increase in the demand for high temperature interconnect solutions at circuit board level joining with recent introductions of high power semiconductors and increased operating temperatures. Application areas for these new devices include electric vehicles, renewable energy, avionics and oil and gas. Reliable operation in these environments requires a combination of performance improvements in components, interconnects and substrates. At higher temperatures (above 200oC), ceramic based substrate options tend to dominate over organic resin based systems. They can also be costly, heavy and prone to mechanical damage. The National Physical Laboratory has undertaken several projects to better understand the performance enhancements required in interconnection materials to operate reliably in these harsher environments. The collaborative project with industry has developed a coating system for organic matrix PCBs, designed to operate at 250oC. The results show a significant improvement of mean-time-to failure (MTBF) for coated PCAs and PCBs compared to uncoated samples. The primary performance improvement is shown to be reduction in the oxidation rate of copper in both the inner and outer layers of tracking in the multilayer structures

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