NPL – Impact of Surface Mount Rework on Reliability

When:
May 11, 2016 @ 6:30 am – 7:30 am
2016-05-11T06:30:00-07:00
2016-05-11T07:30:00-07:00
Where:
Webinar

https://attendee.gotowebinar.com/register/1168111628862733057

Presented by Martin Wickham and Bob Willis

Does rework impact the reliability of modern printed board assemblies? What is the weak link in the chain and how could reliability be assessed? There is a limited amount of data on the impact of rework on printed board assemblies, even though some industry sectors say they do not allow rework. This webinar will look at some of the results of testing on solder joints and the impact re-terminating components and the possible problems associated with mixing lead-free solder alloys.

Topics covered: Rework procedures | Rework failures on solder joints, components and PCBs | Reliability test results | Difficulty in the assessment of reliability rework

This webinar will run for between 45-60 minutes, with a Q&A session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented and links to NPL reports will be provided after the webinar.

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