NPL – Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits

When:
July 16, 2019 @ 6:30 am – 8:00 am
2019-07-16T06:30:00-07:00
2019-07-16T08:00:00-07:00
Where:
webinar

https://register.gotowebinar.com/register/3014133401444469762

Achieving high reliability in service is the key issue in today’s high density electronic circuits. The voltage applied to the electronic circuit plays a very important role in electrochemical reliability. Insulation Resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit. The test voltage for existing IR measurement are only up to 300 V. Trends for more electric vehicles mean that the measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1000 V. NPL has commissioned a 1000 V IR test facility. CAF formation inside PCBs is an important failure of the electronic circuit. Special designed PCBs with CAF patterns of different via to via distances will be tested at different voltages up to 1000 V. 1000 V AC voltage will also be tested. The relationship between via to via distance and test voltage of CAF failure will be investigated

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