IWLPC 2020 International Wafer-Level Packaging Conference

When:
October 23, 2020 – October 25, 2020 all-day
2020-10-23T00:00:00-07:00
2020-10-26T00:00:00-07:00
Where:
College Park
MD
USA

https://www.iwlpc.com

IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Advanced Packaging in the New Connected World reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

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