Hobbs – Physics of Failure, Electronic and Mechanical Failure Modes and Models

When:
December 2, 2020 @ 8:30 am – 12:30 pm
2020-12-02T08:30:00-08:00
2020-12-02T12:30:00-08:00
Where:
webinar

https://register.gotowebinar.com/register/7394352444180841744

By Dr. Alec Feinberg

$400

There are many aspects to the science of physics of failure. In this course we approach the subject by dividing it up into two main sections:

Physics of Failure 

Mechanical Failure Modes & Models

IC & Electronic Failure Modes & Models

This 4 hour course, which costs $400, is an in-depth approach to physics of failure. 

It is designed for the engineer who wants a good knowledge base including the state-of-the-art in this area.

The following outline provides an overview for each section

Physics of Failure Introduction 

oFour main types of aging 

Physics of Failure Tools (Mechanical Failure Modes & Models)

o   Mechanical Plastic Deformation: Elastic deformation, yielding (with vibration) and ductile rupture (with shock) material considerations

o   Creep &  cumulative creep fatigue material considerations, viscoelastic creep, creep acceleration factor 

o   Excessive wear; friction & lubrication – types of wear, vibration wear, material selection & hardness, wear acceleration factor

o   Cyclic Fatigue: Exact method for damage estimation (derivation using thermodynamic work) 

o   Miner’s approximation – derivation, why it is an approx., stress concentration 

o   SN curves – material selection  

o   Fatigue ( SN curves, Basquin’s  and Coffin-Manson -high and low cyclic fatigue, Loading Types – stress corrections, Facture Mech. Vibration fatigue, when SN Curves not available) 

o   PCB fatigue life – Circuit board component fatigue life model analysis –Steinberg Method (sine and random) 

o   Thermal cycle (strain, fatigue, acceleration factors derivations for Coffin-Manson & Modified, Norris-Landzberg)

Physics of Failure Mechanisms – IC and Electronic Failure Modes and Models   

oThermal Cycle CTE Mismatch: Failure Modes & thermal fatigue in solder joints

oEngelmaier IPC Solder Joint Life Model, BGAs

oUnderfill Modification to Englemaier model

oTemperature: Thermally Activated FMs

oJunction Temperature Modeling

oVoltage Issues: ESD, EOS, TDDB, Dielectric Breakdown

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