Hobbs – Lead-Free Solder Joint Reliability Basics

November 17, 2021 @ 8:30 am – 12:00 pm


By Dr. Jean Paul Clech


This webinar reviews basic board, component and board assembly parameters that effect solder joint reliability regardless of solder composition, tin-lead or lead-free. Rules-of-thumb and design-for-reliability guidelines are presented that are of help to improve solder joint life under both thermal and mechanical loading conditions. Accelerated testing procedures and acceleration factors are also discussed briefly. This introductory webinar will be of interest to beginners as well as experienced technical staff needing a refresher on designing for solder joint reliability in electronic assemblies.

This webinar will emphasis on board and component effect and generic guidelines that can be used to minimize the risk of solder joint failures in circuit board assemblies. While the webinar ends with an overview of lead-free solder joint reliability trends, solder alloy specifics are not covered. Numerous rules-of-thumb (do’s and don’ts) are presented based on established industry practices and field failures encountered by the instructor.

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