By Steven Carlson
This webinar meets 4 times March 5/6/12/13 from 8:30am-Noon Pacific time
This is the two day seminar presented as a webinar over 4 days, 3 hours each day. Attendees must participate in all four days. This webinar will focus on:
1. To understand how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments, and how these factors affect fatigue life.
2. To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments.
3. To understand the concept of “damage accumulation” and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
This course is based upon the popular book Preventing Thermal and Vibration Failures in Electronic Equipment by Mr. Dave Steinberg.
Questions are encouraged during the webinar, to make sure each participant understands the design techniques and applications presented.
WHO SHOULD ATTEND?
R&D Electronic Engineers and Managers
Quality & Reliability Engineers
Application and Sale Engineers