By Dr. Kourosh M. Kalayeh
Due to the higher I/O density and smaller electronic packages in the past decades, the demand for high density interconnects (HDIs) has increased significantly. Microvias are essential elements in HDI Printed Circuit Boards (PCBs) and failure of these structures are among the most common causes for open circuit in these boards. This makes the reliability of microvias of great concern among electronic industry.
In this webinar, Dr. Kalayeh will briefly discuss common failure mechanisms in microvias and plated through holes and highlight their differences. He will also talk about the common manufacturing defects and how they influence the reliability of these structures.
Dr. Kalayeh will then talk about the challenges and pitfalls associated with the modeling of these devices using the method of finite elements. The importance of statistical analysis on fatigue life prediction of PTHs will be highlighted as well. Recommendations and guidelines will be offered to overcome these challenges.
Last, Dr. Kalayeh will provide a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.