By Gil Sharon
Random vibration is a significant contributor to fatigue failure mode of solder joints and leads in electronics. A considerable amount of time and effort has been devoted to predicting and preventing electronics failures due to vibration loads. This webinar will explore the various parameters that need to be considered for modeling circuit cards. The topics covered will include mesh considerations and how to use the correct damage indicator for both failure modes. The webinar aims to explain the current best practices for model creation, solution parameters for PSDs and the post-processing of the solution.