By Craig Hillman
As the automotive industry undergoes radical transformation with electrification and autonomy, there is an increasing need for semiconductor devices that last longer and can operate at higher temperatures. In response, the Automotive Electronics Council (AEC) released a new grade of electronic parts rated to 150 C. These devices promise more robust behavior than ever before, but automotive OEMs and Tier 1 companies are struggling to determine if the new technology will be sufficiently reliable.
In this seminar, we will present a clear and concise workflow using Ansys Sherlock that shows designers, thermal/mechanical analysts and reliability engineers how to accurately evaluate the reliability of critical components at the earliest stages of the design process. Using validated physics simulations, predictions for the most critical failure mechanisms, including dielectric breakdown and solder fatigue, will be demonstrated.