DFR – Guaranteeing Reliability with Thermal Cycling

When:
January 28, 2016 @ 8:00 am – 9:30 am
2016-01-28T08:00:00-08:00
2016-01-28T09:30:00-08:00
Where:
Webinar

https://attendee.gotowebinar.com/rt/1605282949803234305

Presented by Nathan Blattau

This webinar provides an overview of thermal cycling induced failures in printed circuit board assemblies. The two main failure modes that are explored are solder joint and plated through hole fatigue. A close examination of the effect of board properties will also be provided. We will discuss the usage of analytical and semi-analytical prediction methodologies.

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