By Seth Binfield
As circuit designs shrink and become more complex, flux residues are more likely to cause electronics failure. Chemistry of the residue, application of flux, design and coating are all factors in determining the risk of failure. Understanding all these factors will allow you to minimize your risk.
• Chemical composition of most liquid fluxes and its effect on risks of failure
• Best practices in flux application
• Analytical techniques during or after the assembly process
• Other factors affecting risk of failure