CALCE – Printed Hybrid Electronics (PHEs): Are They Really Ready for Deployment ?

When:
November 17, 2020 @ 8:00 am – 9:00 am
2020-11-17T08:00:00-08:00
2020-11-17T09:00:00-08:00
Where:
webinar

https://umd.webex.com/mw3300/mywebex/default.do?nomenu=true&siteurl=umd&service=6&rnd=0.9352021517027117&main_url=https%3A%2F%2Fumd.webex.com%2Fec3300%2Feventcenter%2Fevent%2FeventAction.do%3FtheAction%3Ddetail%26%26%26EMK%3D4832534b0000000461a4d0decc4479ae1dcea702e3c2c9bf2d80d70afbb666887ab1bb28bf38a4dd%26siteurl%3Dumd%26confViewID%3D176538217016755186%26encryptTicket%3DSDJTSwAAAAQlZr0vsOk9HKViCKbqXnrSbIlHcPKezitzgev49F9RZQ2%26

By Professor Abhijit Dasgupta

A team of UMD researchers and collaborators have been exploring the use of direct-write additive manufacturing methods for fabrication of electronic components, substrates and interconnects; to develop printed hybrid electronic (PHE) assemblies. The two primary methods being investigated at this time are syringe printing and aerosol jet printing (AJP) processes. Using a 5-axis AJP platform, electronics are being printed in geometrically-complex, curvilinear 3D form factors.

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