By Dr. Michael Osterman
Due the Restriction of Hazardous Substances (RoHS) regulation, lead free (LF) solders, such as tin silver copper (SAC) and its variations, are being used in microelectronic products. To address issues with shock durability and cost, the silver content in SAC solder has been reduced for some application. This change in silver content has implications for thermomechanical durability for SAC solders.
In use, temperature cycling is a major contributor to the wear-out failure of solder joints during the life span of electronics. To predict the reliability of electronic solder joint, a fatigue life model for solder interconnections is needed. Currently, strain range and strain energy density based models are widely used for solder joint fatigue life estimation.
This webinar will review existing solder fatigue life models, discuss findings from accelerated tests on silver contents impact on SAC interconnect durability, and provide strain range and strain energy based fatigue life models for a variety of SAC solders.