CALCE – Concerns with Copper Wire Bonds under Thermal Aging and Cycling Condition

When:
August 20, 2019 @ 8:00 am – 9:00 am
2019-08-20T08:00:00-07:00
2019-08-20T09:00:00-07:00
Where:
webinar

https://umd.webex.com/mw3300/mywebex/default.do?nomenu=true&siteurl=umd&service=6&rnd=0.3944357229943197&main_url=https%3A%2F%2Fumd.webex.com%2Fec3300%2Feventcenter%2Fevent%2FeventAction.do%3FtheAction%3Ddetail%26%26%26EMK%3D4832534b000000047471891e482dc19c439c5c1778a6736f6b4003722b1514eec5fd3aa38db6c6b5%26siteurl%3Dumd%26confViewID%3D135600625523106474%26encryptTicket%3DSDJTSwAAAAQHm0_5l82sFq2UCR9e20mDv_2wYmX80PmLvp1Py7bCKQ2%26

By Subramani Manoharan

Copper (Cu) wire bonds have become the dominant wire material used in microelectronic packages, having replaced gold (Au) in the majority of applications. Cost saving has been the key factor to drive this transition in wire bond material, although there are other advantages to Cu such as better electrical and thermal conductivity, reduced wire sweep during transfer molding and most importantly slower intermetallic compound (IMC) formation with Al (bond pad). Although IMC layers are much thinner than for Au-Al bonded joints, growth of second phase, Cu9Al4, due to exposure to high temperature leads to interfacial separation, which is exacerbated under thermal cycling condition ultimately leading to failure of the joint.

Comments are closed.

Powered by WordPress. Designed by WooThemes