Miniaturization, component density, and harsh environments, have contributed to the increasing in-field failures of circuit assembles caused by electrical chemical migration (ECM). Post-reflow contamination removal is one of the fastest growing reliability-enhancing processes.
How is contamination effectively and safely removed from circuit assemblies? How does a cleaning process work? What is considered to be a clean assembly? This non-commercial webinar will explore these and many other common questions related to cleaning.